Processing of support substrates for semiconductor wafers
Even with a 10mm corner, it is possible depending on the processing method! During prototype development, we can process from just one piece.
At Musashino Fine Glass, we accept processing of support substrates for semiconductor wafers. We offer substrates made of borosilicate glass, non-acrylic glass, and quartz glass. Rectangular substrates can be processed up to a maximum size of 370×470mm, and circular substrates up to a maximum diameter of φ300mm, with processing methods available for sizes as small as 10mm square. During the prototype development phase, we can process from just one piece, so please feel free to consult with us when needed. 【Processing Overview】 ■ Processing Substrates: Borosilicate glass, non-acrylic glass, quartz glass ■ Processing Sizes: Maximum rectangular size 370×470mm, maximum circular size φ300mm (minimum size available upon consultation) ■ Thickness Accuracy: TTV≦1μm is possible ■ Processing Quantity: Processing from one piece during prototype development, mass production is also possible *For more details, please refer to the PDF document or feel free to contact us.
- 企業：武蔵野ファインガラス
- 価格：Other
